SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) announced today that it has entered into an agreement to acquire Future Facilities, a leading provider of electronics ...

Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form factors shrink, electronics cooling is no longer a late-stage check — it’s ...

Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital ...

Several aspects must be taken into account when dealing with power electronic design. Within a system we can identify different elements such as thermal dissipation, electrical characteristics, ...

New long-running, fully agentic workflows spanning EDA to CAE multiply engineering productivity.

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

QSPICE is an analog and mixed-signal simulator characterized by high simulation speed, accuracy and reliability. It is a new program and can be downloaded here. QSPICE is still in the demonstration ...